標題: 請問在畫IC佈局時~有哪些問題需要考慮的~ [打印本頁] 作者: vadj 時間: 2007-11-8 01:12 AM 標題: 請問在畫IC佈局時~有哪些問題需要考慮的~ 請問在畫IC佈局時~有哪些問題需要考慮的~* m# V: `2 w# K5 ]$ F) ]1 f
例如天線效應、對稱性、latchu, I3 n7 ~- N( A3 \
請問還有些什麼呢？ / m) v* d* q. C' G- a% yPS 先不管是畫什麼電路，就請先說一些基本一定會考量到的問題。謝謝作者: 小朱仔 時間: 2007-11-8 01:53 PM
很重要的一點8 q: ?4 E. [4 s2 g B) M% A. ^
耐電流; j8 [; ]4 x9 t4 x% [
每條走線的耐電流 2 Y+ n( I: R# f: Y2 k9 Z$ {I/O Pad的電流0 L$ J# P' K$ N( \$ @
IR Drop 6 E4 ]5 r/ D: n* V7 R3 l" aMatching9 v8 A2 ~6 ~/ t/ W
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etc....作者: billionwong 時間: 2007-11-12 10:38 AM
1. Chip size. You need to know what kinds of package will be used. / v5 W$ B1 \; Z7 F: x R2. Pad location. You need to confirm with supplier about the bond wire bonding. 3 ^! E, n6 {6 }: x& {+ W( X# x( R F3. ESD and latchup consideration. 0 ]4 A! D. D/ {! R* A
4. Any noisy circuit inside the circuit. If yes, you may need to isolate those noisy circuits with double guard ring or individual ground and power path.. ~2 T( w3 ~9 G9 v4 E
5. The current consumption on the whole circuit. It will affect the metal width of each building block and the whole circuit., Z6 `& M: j: U
6. Make sure there is no softcon connection.! z* ^- @/ G% g, w, s6 y( d
7. How many metal layers could be used ? / q a2 j1 u9 S" ]+ d* Q8. Metal Density consideration.作者: bjic 時間: 2007-11-12 04:14 PM
问客户，做客户想要的。也就是前端工程师 2 J# A8 [( t: J; k( ~& \当然有时候还要凭自己的经验判断。作者: yoyo20701 時間: 2007-12-22 06:26 PM
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