標題: Flip chip Manager level in China mainland [打印本頁] 作者: Achris 時間: 2009-6-18 12:44 PM 標題: Flip chip Manager level in China mainland We are searching for flip chip R&D mgr, process mgr, project mgr for a well-known assembly and test house located in Shanghai, China. Below jd is for process mgr. Should you have any questions or concerns, please contact me by achris@edachr.com, 86-21-63203354, Achris Shen, we are a professional job-hunter company in semi market in China. . i1 f) J! Q8 ~& @: }% t- z& Y . y5 Y2 L- s5 l2 M+ e. U# tPurpose of the Job (Why the job exists): * x" m7 @7 z, h$ U1 z1. To define and develop new packages and technologies through benchmarking and interaction with PLM. % Q. f: s7 [; R# {- c2. To manage projects for on-time development through effective resource allocation and planning for rapid deployment of new technologies and products. . o" d3 ]! A) F' G( b
3. To transfer enabling technologies and products to relevant factories. 4 g; I" w, `. [; q5 A; h
4. To support and coordinate customer programs through interaction with customers and upper level management7 M, c O/ @, R j
5. Make a plan or roadmap for future demand in market or customer.5 d% l. k0 f c. A/ a+ `
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Key Job Accountabilities (Actual daily deliverables):4 G6 A; H$ b0 z" N, ]2 R) V
1. Communication with customers and Emerging technology/PLM. L) |! p$ x8 ^. k p% l2. Coordinate cross functional team activities |, J( K; C) N1 v7 U. v
3. Assign and review each engineering tasks and plans, or all project tasks and plans of project manager * Z7 r0 \& q7 \" v( \9 b4. Ensure key deliverables are met for each stages of phase development procedure. 0 Q9 s( I* t& ~" M) w& E5. Update and discuss key issues with upper level management' ?0 O A+ n7 Z F9 S
6. Adjust plans and update / modify current activity / engineering direction based on engineering data. 5 f1 M! _& R d) A/ d% A, M4 @6 i7. Patent infringement search & IP generation ; z+ s; t7 t! E/ i ) P: z3 Z( Y# q/ C) ]
Reporting Relationships , y% L# `# {7 q/ n8 M$ w
Report to Director 8 a% J# w5 F" u4 x6 a5 z. y. m6 OMTS, Senior Engineer, Engineer reports to this position' [' l: X% m6 z( ^# o' L- S
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Required Experience and Qualifications8 V5 x4 l4 _8 h0 c. m! x: f
1. Minimum 8 years experience in FlipChip in both unit or strip form both as a similar position in a high volume and highly auto semiconductor operation. ) b" X6 d# R. k$ g2. Flip chip process integration experience (Die saw, FCA, UF, Molding, SBM, Marking) - V/ n$ n, j3 m `: `. G3. Wafer bumping process