標題: SiP未來的出路 [打印本頁] 作者: newstudent 時間: 2009-7-17 09:35 PM 標題: SiP未來的出路 SiP未來的出路如何？ " D1 \: V3 V1 j/ n8 @沒有前段IC設計的經驗,只有後段封裝經驗,和RF component設計經驗,( A; \4 }4 c: [% @; n( @
沒有整個系統的概念,如何切入做SiP?作者: ychchip 時間: 2009-7-17 10:44 PM
SiP is useful to high density package, especially for a system integration.. K- |9 u; x( W* R4 D2 c* V6 q9 k
maybe it becomes more important technology recently. however, the potential in future sound compatiable with 3-D IC. Recently, It becomes a focus point in eduation of Taiwan. More universioties had the relative class.