| Time | Date : May 27, 2014" , 9:00am-5:30pm Cost : Free with Registration | | 08:30-09:00 | Registration | | 09:00-09:10 | Welcome address from ANSYS Taiwan Country Manager - Robby Tung | | 09:10-09:20 | Welcome address from TADC President - Nerow Yang | | 09:20-09:40 | ANSYS Corporate keynote speech - Tom Kindermans,VP/Field Operations for Asia,ANSYS inc | | 09:40-10:00 | Customer Keynotes Speech : System-Aware Design Optimization - 蔡志忠副總,VP/Himax | | 10:00-10:20 | Customer Keynote Speech : Making the impossible possible - Everyday genius - Herbert Lee, MTK | | 10:20-10:40 | Finite Element Analysis in Orthopaedic Biomechanics – 徐慶琪 教授/NTUST | | 10:40-10:55 | Coffee Break | | 10:55-11:30 | Comprehensive Simulation Practices - David Street, Director of Marketing and Business Development Asia/ANSYS | | 11:30-12:05 | ANSYS最新技術亮點展示 ANSYS | | 12:05-13:30 | Lunch (1 hr 30 min) | | | HF / EMI | SI / EMI | EM / Motor | Mechanical | Fluid | IC Level | | | Room A | Room B | Room C | Room D | Room E | Room F |
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| 13:30-14:00 | Field and Waves in Substrate-Integrated-Waveguide in Millimeter-Wave Three-Dimensional Packages and Modules 莊晴光教授/Honorary Life Prof. Ching Kuang C. Tzuang/IEEE Fellow/NTU | EMI Simulation and Analysis for Multi-PCBs Design ChrisHY Yang / Advantech | 無刷雙饋電機之設計與模擬分析 謝旻甫 教授 / 馬達中心主任 | Best practices for contact modeling using ANSYS / ANSYS | ANSYS流體技術新發展(By Dr. Xiao Wang, ANSYS Inc.) | 13:30~14:30 OIP ecosystem in mobile and FinFET era Willy Chen / Department manager, TSMC Design Methodology & Service Marketing |
| 14:00-14:30 | 大面積PECVD電漿鍍膜設備模擬研究與設計開發 黃俊凱/ASIATREE | Efficient Assessment Method of Via & DIP Type Connector Stub Impact Eason Lu / Advantech | BSG(belt starter generator)的設計與分析 陳逸萱 / 華擎 | 風機馬達高剛性及結構噪音最佳化 | 馬達和變頻器的散熱和系統整合分析 | 14:30~15:30 Co-design for high performance SOC - timing, reliability & performance challenges Ricky Yong / Department manager, Mediatek Design Technology |
| 14:30-15:00 | Circuit-Defined Antenans for 4G Terminal Devices 翁金輅教授/ Prof. Kin-Lu Wong/ IEEE Fellow/NSYSU | Analysis and Measurement of Complex Near Fields for SI/EMI Applications 洪子聖教授/ Prof. Tzyy-Sheng Horng/ NSYSU | Maxwell在中大型旋轉電機之應用 鐘戊興 / 東元 | 高功率元件熱傳分析和設計 | 以離散座標輻射技術對燈具光學模組結霜和除霜多相流分析技術 |
| 15:00-15:20 | Break (20 min) | 15:30~15:50 |
| 15:20-15:50 | EMI Design Analysis for Digital Signal Propagation on PCB 林漢年 / FCU | A Wideband Common-Mode Filter for Single or Multiple Differential Pairs Interconnects 薛光華教授 / 中原大學 | 車用動力馬達多重物理耦合分析與驗證 藍亦維 / ITRI | 超大型結構採用多nVIDIA GPU平行化計算技術 | 使用ANSYS FLUENT在18吋晶圓CMP程序分析技術 | 15:50~16:50 Power and Reliability Challenges for Designs based on FinFET Technology Ming Ting / Director, Apache Product Specialist |
| 15:50-16:20 | Challenges and Solutions for EMI/RFI issues from High-speed Connectors 吳宗霖/IEEE Fellow/NTU | High Speed Display Interface SI/PI/EMC Co-design Mr. Sam Yang/ Himax | Analysis of Resolver with cosimulation based on Maxwell and Simplorer/MatLab
王培仁教授/Prof. Pei-Jeng Wang/NTHU | 高精密度光學成像系統耦合機構熱傳分析 | 基於EXCEL環境進行樣板式的 設計變更: 某一半導體設備的腔體設計 |
| 16:20-16:50 | Eldon Ph.D/ ANSYS | An automation adaptive design and analysis platform Alex Wang Ph.D/ ASE | Marius Ph.D/ ANSYS | 新一代ANSYS客製化環境應用- ANSYS Customization Toolkit (ACT) / TADC | 高瓦數LED封裝的熱傳和結構 耦合分析(ANSYS Icepak-ANSYS Mechanical) | 16:50~17:50 Chip modeling technology for DDR I/O SSO analysis Michael Lin /AE Manager, Apache Taiwan |
| 16:50-17:20 | | | | 使用ANSYS ROM模型在MEMS元件機電參數最佳化設計 | 高效能泵體的運轉效能提升-葉形和馬達設計 |