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speaker: Mr. Wilhelm Radermacher, Senior Director, Mixed Signal & RF Solutions, Semiconductor Test, Verigy 38p
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9 b; h! ^7 f: O9 s# T, zThe Semiconductor Cycle of Innovation4 u$ _; S! B2 y
TSV = Extreme Version of 3D Stacking$ A* W/ ~2 \8 Q3 @. e0 g
8 ~& y+ K, C8 w K( v• Applications
5 D" L( b- F" S) T' j% C• Test challenges# @" p6 G7 r% i
• Proposed test flow
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