; b3 H! O( D& T7 B% _1 aAbout InShape and OutPerform / ^# O! i7 e- Y) | }3 S& eInShape™ is the first model-based full-chip Design Manufacturability Checker which allows designers to improve yield during physical design implementation by quickly and accurately accounting for systematic manufacturing variations. InShape provides designers with DFM hotspot detection and enables repair based on fast, silicon-accurate contour shape prediction across the process window. + C9 s/ ?$ Y$ y# ~: |5 b1 n" h0 r& n4 y' N: ]$ t
OutPerform™ is the first electrical DFM analysis and optimization product to control and optimize the impact of systematic variability on designers’ chip parameters using fab manufacturing data, capturing the effects of RET, OPC, CMP, mask, etch and lithography on both device and interconnect. OutPerform takes in designers’ physical design and timing data, along with encrypted fab technology files and critical dimension (CD) data from silicon contour shapes predicted by InShape across the process window, and automatically produces a DFM electrical hotspot report for timing and leakage power. OutPerform also creates optimization directives for timing that can be input to the designers’ place and route or layout tool. + T2 X8 Y* P3 K) x; C- t3 V/ ~ 0 h: H/ e' Q ^) ]2 ?6 w9 c2 OAbout Clear Shape x P" {( x/ n
Clear Shape Technologies, Inc. is focused on delivering a complete Variability Platform that allows designers to control and optimize the parametric and catastrophic impact of systematic manufacturing variations. Clear Shape’s products are based on patent-pending technologies enabling designers to efficiently achieve entitled performance and yield. Clear Shape's flagship product InShape ™ is in the DFM qualification program of all the major pure-play foundries and has been silicon-correlated at several IDMs. OutPerform, industry’s first eDFM product has also been silicon validated. Clear Shape is backed by top-tier venture investors that include USVP, Intel Capital and KT Ventures (KLA Tencor). The company is headquartered at 3255-3 Scott Blvd, Suite 102 Santa Clara, Calif. 95054. For more information, visit www.clearshape.com or call +1 (408) 833-7130., }) @* ~( x( i0 [
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InShape and OutPerform are trademarks of Clear Shape. All other legal marks are the property of UMC. ) Y6 a/ V7 s5 y$ Z, g" Q / E7 r/ L# g1 ^; \Note From UMC Concerning Forward-Looking Statements 1 q6 u. V- ~8 U$ U: J2 S
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.作者: chip123 時間: 2008-3-19 08:41 AM 標題: 聯華電子與日商Elpida合作針對日本晶圓專工客戶提供服務 2008/3/18- 聯華電子與全球DRAM晶片的領導生產廠商日商Elpida共同宣佈了一項合作協議，雙方將攜手尋求日本半導體晶圓專工市場的契機。根據此項協議內容，Elpida公司將提供其12吋廠晶圓製造產能，而聯華電子則將提供矽智財支援與邏輯技術。這項針對日本晶圓專工客戶所進行的合作計劃，將採用包含系統單晶片技術在內的先進製程技術，於Elpida公司座落於日本廣島的12吋晶圓廠展開。此項合作將可為位於日本的晶圓專工客戶，帶來更方便的近距離支援。 $ Y; V8 `4 ^; ^1 x8 ?1 e3 x- b4 v
此項結盟係為2007年10月雙方在低介電質銅導線DRAM與P-RAM技術合作的延伸。目前該項合作進展順利，因而促使兩家公司決定尋求更多在研發，以及生產製造上合作的可能性。 0 b9 F& r z9 t( v) u 3 L3 W# M7 B( d此一新的結盟旨在因應日本客戶日益增強的晶圓專工需求。目前有越來越多日本整合元件廠隨著全球產業趨勢的演進，而採取了fab-lite的策略，停止了自行製程技術研發，並且縮減或刪除了資本密集的製造活動。Elpida公司與聯華電子此次的合作，將能同時滿足日本客戶在技術與製造產能上的需求。此外，這項合作預期將使雙方受惠於製造上的綜效。由於兩家公司擁有不同的技術背景，並且可借重於對方的強項優勢，因此這項合作對於Elpida公司與聯華電子都是有利的。" w# C3 F" [1 Y, o
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「我們相信Elpida公司對於日本晶片設計公司來說，是一個很有吸引力的委外廠商選擇，因為我們鄰近的地理位置，同時，我們也不是與這些晶圓專工目標客戶群處在同一個市場內競爭，」Elpida公司總裁暨執行長Yukio Sakamoto表示。「Elpida公司將繼續專注於為手機元件與消費性數位電子產品的客戶生產DRAM。整體DRAM市場是非常多變的，我們相信透過穩定的獲利表現，將使我們的業務得以持續成長。而將晶圓專工納入我們業務項目之一即是一項解決方案。」. V3 Y/ V, S. T0 y7 D