時間 | 議程 | 講者 |
08:40~09:10 | 報到Registration | |
09:10~09:20 | 歡迎詞Opening Remarks | 張肇顯Chang Thomas/產業分析師 |
| 工研院產業經濟與趨勢研究(ITRI/IEK) |
09:20~10:10 | 應用於記憶體之金屬-介電層-金屬技術MIM Technology for Memory | 李隆盛Lee Lurng-Sheng/專案副理 |
| 工研院電子與光電研究所 (ITRI/EOL) |
10:10-10:30 | 休息 Break | |
10:30~11:20 | Total solution of CVD/ALD for future High-K, Low-K and Copper processes | 邱正杰博士/研發副總 |
| 南美特科技 (Nanmat Technology) |
11:20~12:10 | Improving efficiency with scaling to new dimensions and new materials | Dr. Bryan Hendrix /Advisory scientist |
| 先進科材股份有限公司(ATMI) |
12:10~13:30 | 午餐時間 Lunch Time | |
13:30-14:20 | Low pressure CMP for the manufacture of future Moore's Law interconnects with low k dielectric materials. | 宋健民 (James Sung) /總經理 |
| 中國砂輪企業(Kinik Company) |
14:20~15:10 | Challenge & Solution of Wafer Cleaning for 65nm/45nm & Beyond IC Processing | 林啟發/協理 |
| 台灣巴斯夫電子材料 |
| (BASF Electronics Materials) |
15:10~15:30 | 休息Break | |
15:30~16:20 | Materials Development for Advanced Lithographic Processes | Dr. Mark Neisser /R&D Director |
| AZ USA |
16:20~17:10 | 相變化記憶體技術 Overview of Phase Change Memory Technology | 趙得勝 Chao Der-Sheng/工程師 |
| 工研院電子與光電研究所 (ITRI/EOL) |