Test of TSV-Based 3D-IC

Web

speaker: Mr. Wilhelm Radermacher, Senior Director, Mixed Signal & RF Solutions, Semiconductor Test, Verigy 38p
& \( f3 n. ]$ m  h( s& C  [( j" }4 p4 K
The Semiconductor Cycle of Innovation
TSV = Extreme Version of 3D Stacking
0 F; b+ U2 w& Y# c5 ]2 C
• Applications
• Test challenges
, r2 ]: ~: ^* J7 o0 q& j• Proposed test flow
# Y+ {8 ^8 n. W( t0 o• ATE

遊客，如果您要查看本帖隱藏內容請回復

soctest2008

感兴趣这篇文章! 谢谢1
: s. q& ^! [8 Z1 `. [: j
The Semiconductor manufacturing industry is today facing more than ever the challenge to explore the so-called “More-than-Moore” 3-D integration route in order to pursue the continued aggressive scaling of the historical Moore’s Law. The whole Semiconductor industry supply chain is being concerned: from IDMs to Fabless and CMOS foundries, from OSATs to Substrate and Circuit Assembly players as well. We believe 3D integration with TSVs could accelerate even more current consolidation happening in CMOS wafer fabs and the shift toward a fabless foundry model. As the whole industry supply chain is being concerned, all players are at the moment positioning on the technology and evaluating about which 3-D technology platforms need to be invested and developed for their own business

hfutliujun

3D 集成电路可能是将来发展的趋势，但必须要解决3D设计和测试的工具问题，测试是一大挑战。这个材料是个好东西

sungmao

3D siP測試技術是下一世代封裝重要的關鍵技術之一，提早瞭解與佈局可增加成功機會

JSS

最近工作上需完成3D IC報告，看了很多仍有實際狀況上的不了解，需要再多收點資訊......，對這篇文章很感興趣呢

JSS

我今天才註冊,還不太會使用此網站,請問該如何看到檔案呢,因為打不開呀

chunliang26

謝謝大大分享 最近剛好需要找相關資料^^

frank6652

Test for 3D IC is one of the critical factors in the overall process. I would like to learn more details about it.

donovan

最近剛好需要找相關資料, 謝謝您的分享 three dimensional test

stp320161

3DIC 的paper很少見
希望能 從這篇文章中 獲得相關知識
9 q1 n/ j3 i# t! p: S謝謝 分享

maxwell_me

謝謝您的分享
最近正想研究3D IC的部分
由於您的分享，應該可以節省不少時間

Eagle_10_17

熱門的研究話題,最近開始在研究~

BIJM

thank! 最近正在研讀此資料,希望有空可以上來討論~

syhsu64

最近正在研究這個問題,剛好看到大大的分享,希望大家一起為這個產業加油

mitung

3D IC是目前蠻熱門的新技術, 想學學相關新技術.

markb

感  謝   大   大  的  分  享 ！

carter2002

不懂3D IC是什麼技術...下載來看看想學學相關新技術

Emperorfly

Test 一直被認為是3D IC的瓶頸之ㄧ
+ N, J0 J1 S  J( k3 P, f$ i想看看大廠verige怎麼看這個挑戰

tp.wang

感謝大大的分饗, 想了解TSV的測試

jjchao

感謝大大的分享, 剛好跟工作有關,想了解TSV的測試,應用與市場面的需求