|
Product Yield Manager
3 F0 K& C* S9 `& Y! d
$ P4 ]" [$ r& k: }( d公 司:a leading developer of advanced digital imaging solution
" @$ ]' x2 `4 z Y. G工作地点:上海' M$ ^2 a, d2 c v7 t
8 L: J% J! ]- {+ ^4 `7 O5 b. C
Responsibilities:
( O8 }6 D' {- L/ c* \1.Lead a cross function teams of OSC PE/OOC PIE/NPI/US PE for Yield Improvement.
5 v( E; U) f9 ]& W' P3 S; U2.Coordinate and manage engineering activities across OSC,OOC,TW NPI and US PE team to develop and implement continuous improvement programs in yield, quality, manufacture capacity and other operation issues. , B6 G" r6 \ m$ R) ]& E3 H- w
3.Analyze the failure breakdown and dispose of problematic lot or material.
' ~, j$ Z3 ~! p, j- ]0 Q- [4.Support CQE/FAE to perform failure analysis on customer return samples and provide corrective actions to prevent quality issue reoccurred.
0 |: K" G1 \% k3 s0 _, p9 G2 c! r8 K- ?! T; r
Requirements:
- X/ l' E2 }. k$ [; P+ u0 k: Z1.Bachelor or above degree with MicroElectronics, Material & Science or Electronic Engineering related majors. 7 E1 a! M# \: _+ A( {
2.5 years+ related experience on wafer fabrication process integration/yield improvement or Assemble process integration/yield improvement 7 C& H v! s* _$ y/ M
3.Strong communication and stakeholder management
4 x2 G5 o: R8 o2 j9 N3.Good team leader and professional technical knowledge. : P0 H4 o/ h" I) P6 ^+ z+ h6 Y
4.Excellent analysis and problem solve skills.
5 a( ]% X, F& F, v$ h. [( S* a) X5.Excellent oral and written English.
! v2 j- p$ h& Q7 j5 u- r3 a! Y' r6 S% Q6.Optical knowledge/experience will be plus |
|