Chip123 科技應用創新平台

 找回密碼
 申請會員

QQ登錄

只需一步,快速開始

Login

用FB帳號登入

搜索
1 2 3 4
查看: 4370|回復: 6
打印 上一主題 下一主題

[研討會] 9/29 JEDEC Flash Storage Summit Taiwan 快閃記憶體儲存高峰會

[複製鏈接]
跳轉到指定樓層
1#
發表於 2010-9-15 10:55:07 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
活動主旨(Activity Title):JEDEC Flash Storage Summit Taiwan 快閃記憶體儲存高峰會
主辦單位(Organizer):JEDEC, TSIA, ITRI
協辦單位(Co-organizer):
贊助單位(Sponsors):Platinum Sponsor:Macronix, Call Sponsor(Please contact with TSIA)
活動日期(Date):September 29, 2010, 8:30AM-3:45PM
活動地點(Venue):Ambassador Hotel Hsinchu, Taiwan
報名費用(Registration fee):Free
聯絡窗口(Contact Window):Candy Chiang 江珮君, Email:candy@tsia.org.tw
聯絡電話(Phone):+886-3-5913181
傳 真(Fax):+886-3-5820056


分享到:  QQ好友和群QQ好友和群 QQ空間QQ空間 騰訊微博騰訊微博 騰訊朋友騰訊朋友
收藏收藏 分享分享 頂 踩 分享分享
2#
 樓主| 發表於 2010-9-15 10:56:36 | 只看該作者
Darft Agenda:

JEDEC Flash Storage Summit: Hsinchu, Taiwan
September 29, 2010

Location: Ambassador Hotel
188 Chung Hwa Road Section 2
Hsinchu, Taiwan
886-3 515-1111
www.ambassador-hsinchu.com.tw

Program Moderator:
Dr. Henry Lee, CTO from Sunplus Core Technology, Coordinator of TSIA Consumer Electronics Memory Interface Forum and Vice Chair of TSIA IC design committee
3#
 樓主| 發表於 2010-9-15 10:56:57 | 只看該作者
8:30AM-3:00PM Onsite Registration

9:00-9:15AM Welcome
Mian Quddus, JEDEC Board of Directors Chairman
Additional welcome speech by local industry/gov’t official: TBD (TSIA will provide)

Keynote Address

9:15-9:45AM
Memories are Made for This: Mobile Device Applications
Consumer demand for feature rich mobile phone applications continues to rise. This session highlights the current trends in mobile applications and their effects on memory requirements today and in the future.
Presenter: Matti Floman, Nokia
4#
 樓主| 發表於 2010-9-15 10:57:19 | 只看該作者
Morning Session

9:45-10:15AM
Flash Memory Overview: Technology and Market Trends
This session offers a general overview of the flash market and current market trends, basic technical background information, a comparison of SLC and MLC, and the outlook for emerging technologies.
Presenter: Allen Yu, Phison

10:15-11:00AM
UFS Specification Update
The most up-to-date information on the status of the latest high-speed interface standard - UFS (Universal Flash Storage). JEDEC UFS is being designed as a next-generation specification that will enable higher performance and faster data transfer rates when flash memory storage is used in products such as laptops, mobile phones (including smart phones), and other portable consumer electronics devices. The standard will define a multi-gigabit per second high speed interface for embedded mass storage and removable cards. Power, performance, pin count and system scalability are the main focus areas for UFS.
Presenter: Sung H. Lee, Samsung Semiconductor
5#
 樓主| 發表於 2010-9-15 10:57:34 | 只看該作者
11:00-11:30AM
Managing Signal Integrity in Tomorrow’s High Speed Flash Memory System Designs
Expectations for flash memory system performance continue to increase, posing a challenge for managing signal integrity. Learn what factors can cause signal integrity issues, and how proper design strategies can help.
Presenter: Perry Keller, Agilent

11:30AM-12N
Flash Technology: 200-400 Mbps and Beyond

Discover the latest technological trends and technical background information for multi-bit technology and next generation DDR NAND standards being developed in JEDEC.
Presenter: DY Lee, Samsung Semiconductor
6#
 樓主| 發表於 2010-9-15 10:58:04 | 只看該作者
Afternoon Session
1:00-1:30PM

Mobile Storage Applications: Controller Development Challenges
Discover strategies for managing current and future NAND flash requirements for controller development.
Presenter: Robert Hsieh, Silicon Motion

1:30-2:00PM
Transitioning from e-MMC to UFS: Controller Design
If you’d like to know more about controller design challenges that will arise in the transition from e-MMC to UFS, you won’t want to miss this session.
Presenter: Kevin Liu, A-Solid Technology Company

2:00-2:30PM
e-MMC 4.41 and 4.5: Architecture for High Speed – Functions and Features
Learn more about new optional features for enhancing device performance with recently published e-MMC v4.41, including a high priority interrupt mechanism (HPI) and host-controlled background operations processing (BO), as well as planning for version 4.5.
Presenter: Victor Tsai, Micron
7#
 樓主| 發表於 2010-9-15 10:58:10 | 只看該作者
2:30-3:00PM
Solid State Drive Standardization Activities
An update on the status of solid state drive standardization.
Presenter: Sean In, Indilinx

3:00-3:30PM
Solid State Drives: Present Applications & Future Trends
As the data storage market demands higher performance solutions at lower price points, lower power and smaller form-factors, Solid State Drives offer a growth opportunity for the industry and the potential to dramatically expand the overall semiconductor-based storage market. Hear about current applications and future trends for SSDs.
Presenter: Tony Kim, Samsung Semiconductor

3:30-4:00PM The Evolving NAND Flash Business Model for SSD
NAND flash continues to be driven by consumer applications with NAND vendors seeking ways to reduce costs at the expense of certain key NAND parameters. In addition to efforts to reduce the amount of data written to NAND flash, increasingly stronger error correction and additional data recovery mechanisms are required to enable such NAND to be used in solid state drives for computing apps, especially in most demanding Enterprise applications. The advent of soft-interface technology to the NAND industry requires an industry-wide approach to evolve the business model as well as the need for new technical standards allowing the SSD market to grow at the maximum pace.
Presenter: Steffen Hellmold, SandForce

4:00-4:30PM
Enterprise SSDs with Unmatched Performance
Solid State Drives (SSDs) are gaining momentum in the enterprise, replacing hard disk drives (HDDs) by offering higher performance and lower power. However, new NAND Flash technologies are exceeding the capabilities of traditional SATA and SAS storage interconnects. PCI Express (PCIe) SSDs overcome this bottleneck and deliver unparalleled performance while, at the same time, reducing latency, power and cost by eliminating the traditional storage infrastructure and attaching directly to a platform’s PCIe I/O interconnect. This presentation examines the market for enterprise SSDs and the value proposition of PCIe as the host interface for next-generation designs. Factors that are driving the PCIe SSD market are analyzed. Also, the key challenges inhibiting the broad adoption of PCIe SSDs are discussed.
Presenter: Kam Eshghi, IDT


Program and speakers subject to change without notice.
您需要登錄後才可以回帖 登錄 | 申請會員

本版積分規則

首頁|手機版|Chip123 科技應用創新平台 |新契機國際商機整合股份有限公司

GMT+8, 2024-11-17 10:49 AM , Processed in 0.162009 second(s), 17 queries .

Powered by Discuz! X3.2

© 2001-2013 Comsenz Inc.

快速回復 返回頂部 返回列表