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speaker: Mr. Wilhelm Radermacher, Senior Director, Mixed Signal & RF Solutions, Semiconductor Test, Verigy 38p
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The Semiconductor Cycle of Innovation
8 J2 t; u* A; }! {TSV = Extreme Version of 3D Stacking
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• Test challenges: I- w; g: z. `0 }0 t; e
• Proposed test flow4 T) o @' ?, b& L+ s7 C. Q! {- G
• ATE
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