標題: 10/15 Apache Technology Forum 2010 [打印本頁] 作者: heavy91 時間: 2010-10-4 04:23 PM 標題: 10/15 Apache Technology Forum 2010 Date: October 15, 2010 - October 21, 2010 * C# q% M- n+ v; E+ T4 R+ K6 ? Location: Taiwan, Japan, Korea 0 ~9 n7 L7 m" e) l) a 6 a+ ?/ L' K8 O' H/ r1 r: F& h 1 ?$ u6 v/ L) Q5 b! m) hPower Methodology from RTL Design to Chip-Package Sign-off 8 G# s& q$ r% BOverview 1 |8 R8 j: ]% Q; }( Z% GIn this full-day multi-track technology seminar, Apache Design Solutions, along with industry leaders, will share proven methodologies for addressing the most critical design challenges faced by engineers today – power and noise management for electronic designs. Presentations include technology roadmap for 28nm processes and beyond, advanced reliability solutions for electrostatic discharge (ESD) and dynamic electro-migration (EM), and 3D-IC design impact on power, signal, and thermal integrity. Afternoon tracks provide in-depth technical discussions on two key requirements for design methodology – achieving ultra-low power design targets while maintaining design integrity, and meeting system cost and performance needs through integrated chip-package-system design flow. Both presentations will walk the audience through a complete flow using real design examples to provide practical use information that can be applied to their current design projects.4 V6 Z0 M P- @