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Please select the following issues that you believe EDA Tool Vendors should invest in based on your experience and design needs. :o # y& z3 W$ p% d' Y
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Add your comments to further explain how these issues are impacting your design process. And let's discuss these before 2008. 2 j' g8 C; E, M) W
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1.Time and schedule
2 z4 [& {4 Y4 l" w' O2.Parallel designs e.g. layout and design engineering working at the same time
/ L+ j( E7 u! s9 m1 v) j3.DRC/LVS/ANT verification
# V Q5 w2 l* ]* g! d+ q8 l* L$ F s4.DFT
9 h% H5 {' {6 O6 m5.Working in a multi user environment
/ e1 R0 M0 {, V# q6.Incorporating latest process node specifics (e.g. .65, .45 CMOS)
1 I1 T, D# e1 g7.More than Moore technologies, such as high voltage design, high frequency design, high current design, high temperature design, multiple ! \: i, c) d) Y4 G
technology support in a single design, Mems
, c( _. |% K8 ^6 z8 C6 ?0 ]# P0 a |8.Incorporating RF blocks into standard designs (RF SoC Design)
: d4 [- ^+ S: e0 U U9.Dealing with low-power design constraints in an analog world
, r6 l( k* j- @2 P10.Entering, tracking and verifying design intent between electrical and physical design
3 d+ ^0 S+ |0 y/ t3 w11.Assessing parasitic sensitivities prior to full layout 8 n- g0 D, v" k7 V) u; R6 b' a+ t
12.Optimizing circuit construction at 65nm and below ) z0 h, s' ~8 v5 O
13.Techniques for design centering to achieve optimum performance / yield$ T3 ]3 G% s( n0 ?1 I2 X. c2 K
14.Designing up to to six-sigma yield margins
4 H& \; I7 y8 m( w7 x \' x T15.Other, please specify: |
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