Chip integrates baseband, multimedia processing and radio

jacky002

Chip integrates baseband, multimedia processing and radio
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: g* F0 ]0 g/ A. N( JBy Gina Roos
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Courtesy of eeProductCenter
- d# R% o! f+ ]- g3 C(02/15/2008 10:23 H EST)

$ L1 r. z1 z; n$ P* f0 f% X    San Diego, Calif. — Qualcomm Inc. has introduced a new single-chip solution that brings multimedia and broadband capabilities to mass-market handsets. The Qualcomm Single Chip (QSC) QSC6295 integrates baseband, multimedia processing and radio functionality into a single chip, touting cost- and time-to-market advantages to help drive wireless broadband and 3G adoption in mass markets.

# ^" Q; R) e: V% M    The QSC6295, which leverages advanced 45-nanometer CMOS process technology, combines multimedia features, power-saving innovations and broadband data speeds to redefine the capabilities of next-generation mainstream handsets, said the company. The single-chip solution offers a combination of advanced modem capabilities, including HSPA and HSPA+, and rich multimedia features to deliver a next-generation mobile user experience on mass-market handsets.

. _+ c# n# \# A8 K    Key features include:

% B3 y2 n% M$ U; N" r2 ]( |8 S        * 400 MHz ARM 11
        * Support for WQVGA video playback and recording with TV-out
        * 5.0 megapixel camera
. I7 \& `  ?2 }5 ~; H$ I) f4 L        * 3D hardware-accelerated graphics
3 k+ ^$ O( ^5 H0 U; ?' g        * Integrated gpsOne baseband and radio
+ l# \- Y) t% t        * Integrated Bluetooth baseband and radio, FM radio and USB 2.0 HS
        * Support for all UMTS bands and quad-band EGPRS, as well as receive diversity for enhanced data throughput performance
        * 12 x 12-mm package

9 ~2 K, x7 a+ J    The QSC6295 also integrates several features of the UMTS Rel. 7 standard (HSPA+) to deliver increased battery life, as well as a more instant experience with reduced lag.
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. b* K: v: |, o. T- v8 E    Availability: The QSC6295 is scheduled to sample in the first quarter of 2009.
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    Qualcomm Inc., www.qualcomm.com
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Source: http://www.rfdesignline.com/showArticle.jhtml?articleID=206504545

jacky002

請問各位先進，如果要將MAC + BaseBand + RF整合在一起，其難度有多高?
" o- I/ `5 r3 a& o! H9 {0 `! `最近在想一個問題，就是未來的Wireless BroadBand市場，會不會是以NPU + MAC/BaseBand + RF + Switch/PHYs整合在一起的解決方案? 那這樣豈不是一統天下?
到底這樣的SOC其優勢和劣勢會是如何呢?
+ {) g3 z# i; g/ w我先提出看法:
. `5 j0 [+ c5 e( U$ x, t( N) g) j  優勢(Pros): Cost down與高整合度的解決方案
  劣勢(Cons): Power consumption極高，整合技術難度高與Yield Rate低

不曉得各位有何看法呢?