Chip integrates baseband, multimedia processing and radio

jacky002

Chip integrates baseband, multimedia processing and radio

; @' {8 ~& O  LBy Gina Roos


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Courtesy of eeProductCenter
(02/15/2008 10:23 H EST)
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- u0 g/ m1 u1 p: P& z    San Diego, Calif. — Qualcomm Inc. has introduced a new single-chip solution that brings multimedia and broadband capabilities to mass-market handsets. The Qualcomm Single Chip (QSC) QSC6295 integrates baseband, multimedia processing and radio functionality into a single chip, touting cost- and time-to-market advantages to help drive wireless broadband and 3G adoption in mass markets.
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    The QSC6295, which leverages advanced 45-nanometer CMOS process technology, combines multimedia features, power-saving innovations and broadband data speeds to redefine the capabilities of next-generation mainstream handsets, said the company. The single-chip solution offers a combination of advanced modem capabilities, including HSPA and HSPA+, and rich multimedia features to deliver a next-generation mobile user experience on mass-market handsets.
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    Key features include:
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        * 400 MHz ARM 11
8 g) g9 p! F/ @7 @" |( v- D        * Support for WQVGA video playback and recording with TV-out
( U  M3 N; I5 P        * 5.0 megapixel camera
        * 3D hardware-accelerated graphics
        * Integrated gpsOne baseband and radio
& l' @0 n9 T* X1 q        * Integrated Bluetooth baseband and radio, FM radio and USB 2.0 HS
        * Support for all UMTS bands and quad-band EGPRS, as well as receive diversity for enhanced data throughput performance
6 F+ v1 R9 o. W9 R        * 12 x 12-mm package
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    The QSC6295 also integrates several features of the UMTS Rel. 7 standard (HSPA+) to deliver increased battery life, as well as a more instant experience with reduced lag.

    Availability: The QSC6295 is scheduled to sample in the first quarter of 2009.
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$ e1 @, z9 A& _4 K9 V: e' o3 T  K  L    Qualcomm Inc., www.qualcomm.com

  S4 o% L# R& |. L9 f  g7 x2 eSource: http://www.rfdesignline.com/showArticle.jhtml?articleID=206504545

jacky002

請問各位先進，如果要將MAC + BaseBand + RF整合在一起，其難度有多高?
+ S& i2 N1 V. V8 T5 z  Y最近在想一個問題，就是未來的Wireless BroadBand市場，會不會是以NPU + MAC/BaseBand + RF + Switch/PHYs整合在一起的解決方案? 那這樣豈不是一統天下?
到底這樣的SOC其優勢和劣勢會是如何呢?
: E" Z, w# d& p; W5 m$ U( p我先提出看法:
  優勢(Pros): Cost down與高整合度的解決方案
( y* E/ _, M/ d, J  劣勢(Cons): Power consumption極高，整合技術難度高與Yield Rate低
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不曉得各位有何看法呢?