2487| 11
|
SiP Market Outlook 講議分享 |
講者:Dr. Timothy G. Lenihan, Sr. Analyst, TechSearch
41p, 3.4MB pdf, 3 RDB • Definition of SiP – SiP has many different meanings – Stacked die packages, multichip packages, stacked packages, etc. – SiP vs. SoC is not the question • Drivers for SiP – Greater functionality in a smaller area is the driver for consumer and portable products – High performance is the main driver for computers, telecommunications, and military/aerospace – Some applications such as medical driven by both – Applications, such as network systems, driven by the need to decrease motherboard layer counts and complexity • Examples of SiP – Mobile phones – Consumer product such as camcorders and cameras – Military – High performance SiP applications such as computers and network systems • Future of SiP – Embedded components – 3D with through silicon vias (TSV)
購買主題
已有 8 人購買
本主題需向作者支付 3 元Chipcoin 才能瀏覽
| |
| ||
| ||
| ||
| ||
| ||
SIP會是一個高毛利的生意嗎?
| ||
| ||
| ||
| ||
首頁|手機版|Chip123 科技應用創新平台 |新契機國際商機整合股份有限公司
GMT+8, 2025-2-23 01:33 AM , Processed in 0.187011 second(s), 20 queries .
Powered by Discuz! X3.2
© 2001-2013 Comsenz Inc.