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What Custom IC Design Challenges are you facing now?

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發表於 2007-11-12 17:38:00 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Please select the following issues that you believe EDA Tool Vendors should invest in based on your experience and design needs. :o
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Add your comments to further explain how these issues are impacting your design process. And let's discuss these before 2008. ! b9 ^% V( I3 J3 ?
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1.Time and schedule
( W+ x& z5 R& Y: S2.Parallel designs e.g. layout and design engineering working at the same time
9 L3 }! x7 C, z9 I' v0 E3.DRC/LVS/ANT verification
6 q; ~5 p: A7 ?# X4.DFT$ k9 R$ S& n. i2 k, d1 ^% b
5.Working in a multi user environment
; S+ @0 A" }7 l* j9 J' F6.Incorporating latest process node specifics (e.g. .65, .45 CMOS)
0 N) c( D5 A9 l5 P: S7.More than Moore technologies, such as high voltage design, high frequency design, high current design, high temperature design, multiple   
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   technology support in a single design, Mems 6 v# q, g' L) P/ {, c" U2 S0 c( o$ e
8.Incorporating RF blocks into standard designs (RF SoC Design)
5 H5 A8 F# d' d$ K9.Dealing with low-power design constraints in an analog world/ i  A8 {# ^1 B/ G! S8 T
10.Entering, tracking and verifying design intent between electrical and physical design
# T9 t- X9 ?! Q- p7 R11.Assessing parasitic sensitivities prior to full layout & J  s8 v( s2 l, T+ _: D* X
12.Optimizing circuit construction at 65nm and below
( A- f1 ]% `/ V13.Techniques for design centering to achieve optimum performance / yield
0 ~7 Y- |2 x! R4 ~14.Designing up to to six-sigma yield margins+ R2 p( o: V' ]5 V
15.Other, please specify:
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