外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

highspeeddesign

美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！
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Based in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
partners in fast growing ASIA operation team
8 {' ]! s- d) W' r, o+ k& D$ gAssembly and Bumping engineering and operational management include:
- New package and product characterization, qualification and implementation.
- Packaging process improvement, alternative material and cost reduction.
3 f& @8 f( s( q& s+ E, ~* d+ S- Excursion and operation performance improvement.
- Cross-organization functional coordination between package development, product
engineering, supply chain, quality and subcontractors
+ {& U/ O, \2 Z+ o- n1 MRequirements/Qualifications (Education)
% m, @# ]5 @: [- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
- 10+ year hands on experience in assembly and bumping operation
- Oversea management experience on direct OSAT subcontractors and system level
# l* z/ G; Y% o, O9 Bcustomers
* ~  j( F& T( L2 y- Self motivated with strong work ethics
- Excellent negotiation skills
2 e* b( \( [% m0 S2 I: U* S# E- Excellent communication skills in both Chinese and English
4 s9 \4 }  G% h$ T+ f; {- Project management, DOE, 6Sigma.