外商機會(USA)，積體電路Assembly Manager, HsinChu,--Aug.26,2010!!

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美國硬體積體電路企業高薪徵才, NASDAQ上市公司，薪水高，福利好，花紅多，還猶豫什麽，快來參加！！
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Based in xxx Hsin Chu science based industrial park office. Working with world leading OSAT
# h; B3 y' A# D6 B% b, _partners in fast growing ASIA operation team
+ R; C$ K% R; U; s. ]! V& TAssembly and Bumping engineering and operational management include:
* T: s7 d+ v' C. T. v  B- New package and product characterization, qualification and implementation.
; O$ R# O* b( ]) H- b; n7 H- Packaging process improvement, alternative material and cost reduction.
3 D) p# C/ X! B- F! _3 d+ v& a' h- Excursion and operation performance improvement.
- Cross-organization functional coordination between package development, product
/ L1 H; z2 v+ V$ i8 \( P2 Bengineering, supply chain, quality and subcontractors
  C% b! R5 `" J" `Requirements/Qualifications (Education)
- MS or above in Electric / Electronic engineering, Physics, Chemistry, Material science.
  ^8 y2 |+ a+ ~2 D+ i" m- 10+ year hands on experience in assembly and bumping operation
- Oversea management experience on direct OSAT subcontractors and system level
customers
# J, w8 }; I% h; |& N& Z- Self motivated with strong work ethics
7 L/ Q) }1 g5 `- Excellent negotiation skills
- Excellent communication skills in both Chinese and English
$ V% E0 K# k9 L; P3 D; g8 c- Project management, DOE, 6Sigma.