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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead5 |0 I, e! J6 i: V9 d" i: w
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公      司:One world top EDA company
( Z( [1 n4 T5 m工作地点:上海8 l8 R3 |- E$ r

8 m) M2 P6 `* E3 ?3 w( D' ]8 \Position Description:  
2 h' T+ l4 L+ r8 n* `( K0 P1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike. 1 \! g/ z* s7 O) B* v& ^

; P  Y! |# K* G/ X1 d2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers:
3 p" p* Q* T3 `(1) xx  Palladium HW Acceleration Platforms % G/ y9 W8 H9 ?- q9 C0 X% g9 ^
(2) xx Acceleratable Verification IP portfolio
1 u/ ]7 b2 U$ R7 O# h2 t(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis
5 {& C7 k; T/ I4 f4 G* A' c5 c(4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  . G$ W6 X+ i% L, L- y8 q4 z# F; O
1. Experience:  ( y; q/ S7 y  D  s
- Minimum experience required: 10 years  
; |) ~* c( @* ^- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.1 g7 a; P/ c% E; U, p. }
- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.
" r( x9 i% C5 Y2 s4 I3 v; e8 u. h- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired
) |) g& S% N5 T- Strong verbal and written communication skills in English are required  
. O) U- }8 g( S, G8 u- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must 1 @+ L2 A0 U- M/ t5 V8 F
- Hardware verification, including knowledge of HDL simulators and debugging simulations
( o+ i! e! N* a9 X- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.
  r8 ?# Q  i6 v; h- Knowledge of embedded systems and software development for SoCs is a plus
8 w9 J+ H- n$ Z% ]2. Education:  ( M9 i8 L/ k; b0 p
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  
% t- e; r  O3 a8 L3 l; y- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience). & \" F+ z: i- O9 {/ H$ e) l
3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer
- w0 i2 I3 N7 \) A" d公      司:A famous IC company
8 H$ h$ r7 E( H* K工作地点:南京
9 V  ^' l) b, T
) h6 b* k' a  U2 J- ?Key Responsibilities  2 f& d* |$ c8 d) J/ `
Depending on experience, key responsibilities will involve some of the following:  / y: L& g, w2 ^
IC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification. ! D9 }) u/ j, c" w
As a key member of physical design team, your will work on one of most advanced and the most complex chip designed.
# w$ V9 b3 a8 P2 t6 [Leading a team of physical design engineers and resolving the technical related issues.  1 M4 W$ @/ p/ @0 Z+ H
Crosstalk analysis, power analysis, and static timing analysis.  
5 e" y7 C( |, w, i8 q6 r$ y6 DWrite scripts in Tcl to improve productivity.  
8 a' E4 }  s2 E, h/ h- ]& |( v, `$ T8 N) e  @, j# S6 Q/ E3 r
职位要求
# I" M3 x9 m' q  x- ]+ dExperience: 5+ years in physical implementation engineering    8 [3 `5 v+ f. M4 x: q9 @3 o; R0 ]
Essential skills  
. k" V# i2 y0 E# k* y6 kMS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  9 V8 _1 P. _: G0 D$ U
Experience with Magma or Synopsys place-and-route tool set and physical design project implementation.  
6 W- T$ t, N" B% f6 ]Good programming skill. Capable of writing Tcl or Perl.  & K- j0 x8 Y* h  ^* M
Familiar with synthesis, static timing analysis.  
& U5 ~2 v3 ?5 K9 S' d' RSelf-motivated team worker, good verbal and written communication skills in English.  
& r) E( r& x  @0 bTechnical and team leadership proffered. Previous management experience highly desired.  
. ^9 m2 D% m0 U" oExperience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構
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$ ?* C- N# h! D; Y7 f9 U 俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。
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5 k! n8 {/ I9 bTSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」
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Calibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。
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兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。
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為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。 1 f/ a: h; l, `1 ~# ^& q5 W& p

0 R9 W" t0 g5 J) q因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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