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Which verification elements does your team use on your current design project?

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1#
發表於 2013-9-3 15:37:35 | 只看該作者 回帖獎勵 |倒序瀏覽 |閱讀模式
Pls check all that apply, unless you don’t know?
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2#
發表於 2013-10-22 15:35:35 | 只看該作者
Staff Hardware Based Design and Verification Engineering Lead
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1 o* C$ c( D8 d+ ?# ^公      司:One world top EDA company
* |+ O" \5 |1 x* P! l4 F工作地点:上海
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1 T% P" e& U5 R2 O* P  E( n& Q, {$ xPosition Description:  
: S- y, |: K/ S% H8 _2 y2 f1. The Staff Hardware Verification Engineering Lead will be in charge of a team of field engineers to support advanced hardware based verification flow integration engagements with Cadence customers and provide easy-to-adopt packages and workshops to xx  field application engineers and customers alike.
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2. He/she will focus on the technical aspects of the following hardware verification solutions for customer engagements as well as creating demos/workshops to train field AE and customers:
  x2 F, A7 C- p5 y(1) xx  Palladium HW Acceleration Platforms ! `, V! q( c+ D# ]' ]
(2) xx Acceleratable Verification IP portfolio
% N4 ]" m' q4 I: p4 j: c5 k(3) CVA product integration with other xx products such as Incisive Simulation and RTL Compiler for power analysis
% Q# y' x& L. @1 Z6 ?4 V% R* ?& ](4) HW/SW Co-verification solutions for SoC designs
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3#
發表於 2013-10-22 15:35:41 | 只看該作者
Position Requirements:  
0 m$ v; ~9 F% a7 h1. Experience:  5 H' i: T1 h7 o) P6 p# I
- Minimum experience required: 10 years  
8 B' U% l6 H* t' u- i- Expertise in RTL top-down design and verification methodology automation are required. This includes full hands on knowledge of writing and debugging Verilog, VHDL and SystemVerilog based D&V environments.
' v( F6 |. w' ?& r4 X/ n8 O% Q/ q4 y8 R- We would also like the candidate to have good knowledge of SoC design principles, embedded software development and HW/SW codesign and coverification.
* G9 `+ Y: V8 L& M) A5 V- Knowledge of UNIX, C/C++, other scripting programming languages ( Perl, TCL…) is highly desired / M" n9 f) Y' O, v; _: C
- Strong verbal and written communication skills in English are required  
$ s0 c% g' w! o7 d- m- HW acceleration or In-Circuit Emulation or FPGA prototyping experience is a must ; i0 z5 k. q1 e
- Hardware verification, including knowledge of HDL simulators and debugging simulations 8 o% x/ D% L" b
- Hands on experience with using design and verification languages like SystemC, SystemVerilog (IEEE 1800) and VHDL is a must.4 F2 S% P3 E6 B: ?
- Knowledge of embedded systems and software development for SoCs is a plus
7 v) J# v1 j+ {. k9 I2. Education:  . u. h" {2 `, R5 X  S. F% A* G
Ideally the person should possess the BS/BE level of understanding of CS or EE Engineering concepts  : @9 ^+ |9 J: T2 `
- Minimum Education Required: education level of BS with 10+ years experience (or MS with 7+ or more years experience).
2 l2 E" O* X( ]) L6 a3. Travel of 30% of the time should be expected.
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4#
 樓主| 發表於 2013-12-12 09:14:21 | 只看該作者
Senior Physical Design Engineer) G, f' Y; k. p) [/ l
公      司:A famous IC company9 [9 X  `3 O* w
工作地点:南京; t$ n. W5 b- x) ?/ j
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Key Responsibilities  
& a) g, s1 I1 v2 Y0 B& QDepending on experience, key responsibilities will involve some of the following:  ; _7 X7 D% S: O( j: q- c
IC implementation from netlist to gdsii, with synthesis, floorplanning, place and route, timing closure, and physical verification.
7 t# f* q) I# YAs a key member of physical design team, your will work on one of most advanced and the most complex chip designed. - V* k! d' }& o/ f, P) H) E9 V/ z8 l
Leading a team of physical design engineers and resolving the technical related issues.  % f7 D5 y' [7 w* S+ `
Crosstalk analysis, power analysis, and static timing analysis.  
4 @/ t$ f) _( m. h9 k& v; l$ VWrite scripts in Tcl to improve productivity.  
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' g+ a2 x* r2 S6 R) p职位要求
! q$ P/ P2 B& X) z: k' ^  KExperience: 5+ years in physical implementation engineering   
/ E+ J% B% M' U# j1 U9 QEssential skills  
: O3 y( W7 `3 ~MS in EE required.&#8226roven track records of working independently on place-and-route project running and DRC/LVS/ERC/Antenna debugging skills  
" K, q$ v1 f0 w2 s' \% B; g- aExperience with Magma or Synopsys place-and-route tool set and physical design project implementation.  
5 d" Y7 d; b/ {1 O, GGood programming skill. Capable of writing Tcl or Perl.  
+ i0 D; Q" {# k4 p( {Familiar with synthesis, static timing analysis.  
$ `/ I, }+ G7 X7 K5 f! D2 LSelf-motivated team worker, good verbal and written communication skills in English.  9 C' ~) H7 v1 y4 d) q) M/ a9 a1 z; U
Technical and team leadership proffered. Previous management experience highly desired.  1 j2 e& i7 v% E& x9 R
Experience with synthesis, DFT, and verification is preferred.
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5#
發表於 2014-9-29 13:57:16 | 只看該作者
Mentor Graphics 與 TSMC 合作為10奈米推出 IC 設計和結束基礎架構 ; b3 m1 R$ k( z3 R
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俄勒岡州威爾遜維爾2014年9月27日電 /美通社/ -- Mentor Graphics Corp.(納斯達克:MENT)今天宣佈該公司與 TSMC(臺灣積體電路製造股份有限公司,簡稱台積電)達成10奈米(nm) 的合作協定。為滿足用於早期客戶的測試晶片和IP(互聯網協議)設計起動的10奈米鰭式場效電晶體 (Fin Field-Effect Transistor;FinFET) 的工藝要求,已經改進了物理設計、分析、驗證和優化工具。基礎架構包括 Olympus-SoC™ 數位設計系統, Analog FastSPICE (AFS™) 平臺(含AFS Mega)和 Calibre® 結束解決方案 ( Calibre® signoff solution )。 3 ^4 h8 A3 ]0 R# }  P2 g

. v3 y7 f5 S. A7 n, BTSMC 設計基礎架構行銷部 (Design Infrastructure Marketing Division) 高級總監 Suk Lee 表示:「TSMC 和 Mentor正在進行廣泛的工程工作,以便讓雙方的客戶都能很好地利用先進的工藝技術。每一個節點都需要進行許多創新才能滿足新的物理要求、提高客戶設計賦能 (design enablement) 的精確度,與此同時性能更優、轉回時間更短。」 3 Z* a7 g- q% D, ]

$ }$ M6 F# f0 E  n- O; T1 JCalibre 提供佈線形狀的全色彩能力,以幫助設計者指定符合10奈米規則要求的設計艙(cockpit)之外的色彩分配。針對制定積體電路佈線圖,改進後的Calibre RealTime 產品能進行互動的色彩檢查,同時利用晶片廠認可的Calibre結束平臺能使用所有制定佈線工具進行設計。
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6#
發表於 2014-9-29 13:57:22 | 只看該作者
針對10奈米  FinFET 設計,Mentor 和 TSMC 還改進了Calibre 填充解決方案。Calibre YieldEnhancer 中 SmartFill ECO 的功能支援「隨時填充 (fill-as-you-go)」工作流,以確保IP和其它設計模組在設計過程中都能準確地呈現。當部分設計被修改時,SmartFill ECO功能可重新填充僅僅受影響的那部分,從而最小化轉回時間 (turnaround time)。同樣的,為在諸如TSMC10奈米這樣的先進工藝節點上維持設計層級實現高效的佈線後模擬, Calibre LVS 也被改進了。
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兩家公司還聯手調整了 Mentor® Olympus-SoC 的佈線和路由系統讓它能滿足 TSMC 的10奈米 FinFET 的要求。為了能用於10奈米 FinFET,數據庫、佈線、時鐘樹合成、提取、優化和路由引擎都做了重大的改進。 + q: x1 s* Z" [6 K) c

3 p& N% I& R& V( S" _1 Q4 m( N為了確保10奈米 FinFET 設備的準確的電路類比,Mentor 與 TSMC 合作讓 BSIM-CMG(伯克利共多柵極電晶體)和 TMI 模型在 Analog FastSPICE 平臺(如AFS Mega)上能用於高速設備和電路層模擬。Calibre xACT™ 提取產品和 Calibre nmLVS™ 產品也支援新的10奈米 FinFET 模型。
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因Mentor 和 TSMC在設計賦能方面的合作讓客戶取得成功的案例,將於9月30日在San Jose Convention Center(聖若澤會展中心)舉行的TSMC的開放創新平臺生態系統論壇(Open Innovation Platform Ecosystem Forum)會議上講述。瞭解詳情,請參訪TSMC網站 www.tsmc.com
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