某半導體大廠徵求Technical Manager

chip123

Title Responsibilities：

+ a/ [* l! @0 h( y+ T+ N1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.
3. Planning, setting priority, and exeution of short and long term tasks.       

: X6 j0 e, W3 T6 jRequirements：

' q8 r& P; i4 f- g1. Minimum master degree in engineering field
( X) J1 `1 y% r0 k; ?2. Minimum 5 years of experiences in process integration or device engineering.
& I0 O$ R  I: k3. Candidate with design or product experience is a plus
4. Fluent in English.
5 P# n* ~/ Y5 R9 _4 R5. Work location in Hsinchu, Taiwan."
) Y9 [$ s8 Q: I1 X( B
Package： around annual NT 300萬 ~700萬

7 `5 E* ?5 t7 t- B- c. XStock： providing stock option depends on experience
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意者請與 chip123@chip123.com.tw  聯絡！