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Title Responsibilities:
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$ P5 r A6 |. q. b8 t5 v! l1. Coordination among module engineering, SPICE, desgin service, reliability, fab, on technology development.
, p; U* [. \3 A! e; H2. Responsible for leading and mentoring an engineering team in process characterization, problem solving, yield improvement, and documenation.+ H# G. |1 O2 M- ]
3. Planning, setting priority, and exeution of short and long term tasks.
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Requirements:
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1. Minimum master degree in engineering field/ E7 n& \1 J5 t" U0 L7 D6 X' v
2. Minimum 5 years of experiences in process integration or device engineering.
' B* J, ]6 M1 a$ m/ I) X1 |3. Candidate with design or product experience is a plus
7 p- @2 A" P( A; y4. Fluent in English.
" n2 ]# Q+ \$ t4 d/ B/ ?& P5. Work location in Hsinchu, Taiwan."
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Y5 z, Y0 G; C4 g5 `Package: around annual NT 300萬 ~700萬 |6 j% o g- L" `
( Y6 Y. T" a- B) ]( m/ L& x7 n3 GStock: providing stock option depends on experience
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+ k3 N8 ?+ r3 A+ c, U! D) h意者請與 chip123@chip123.com.tw 聯絡! |
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