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發表於 2010-6-25 08:50:33
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Abstract -- The diode operated in forward-biased condition has
5 E; ^% F- d3 L8 D, x) j4 O$ ybeen widely used as an effective on-chip ESD protection device at
! C1 {7 Q( F. m6 Y# o, W% TGHz RF and high-speed I/O pads due to the small parasitic
' p) a: [' X0 }9 I, Aloading effect and high ESD robustness in CMOS integrated
8 A6 R5 a: @- j( Xcircuits (ICs). This work presents new ESD protection diodes: A( G' `1 e' y& q
realized in the octagon, waffle-hollow, and octagon-hollow layout6 }4 T# T g- _
styles to improve the efficiency of ESD current distribution and
$ @$ ?1 p1 f# Q! dto reduce the parasitic capacitance. The new ESD protection
- Z6 }3 z; F7 h- s+ ~diodes can achieve smaller parasitic capacitance under the same
. F& `* \( K. e7 w1 sESD robustness level as compared to the waffle diode. Therefore,
% D4 v' h* z1 O/ v. ~the signal degradation of GHz RF and high-speed transmission
1 l# m& w; A9 H- L) M0 D2 R- T, c0 ocan be reduced due to smaller parasitic capacitance from the new( R1 x; ^# s' z- q9 S: D
proposed diodes. |
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