|
招聘公司:A famous IC company t6 Y$ `# x1 C6 n' \) s0 M1 O
招聘岗位:Sr. WLCSP development engineer
$ w9 Z' j3 ^8 Y3 F2 w0 o6 x' C* b工作地点:Shanghai
% g$ C Z7 s, H: h0 ~* G2 u
2 K \: E& m9 D- v- l岗位描述:
0 A3 H- k3 S; b4 ^1) Act as WLCSP RD project leader for all the WLCSP related activities. 2) Integrated with Process / Product Engineering, Production, QRA, Final Test and Maintenance teams in the WLCSP assembly problem solving. 3) Developed new WLCSP packages from feasibility, design, process development, qualification to mass production. 4) Design the new WLCSP package for new application or performance improvement. 5) Improve the WLCSP assembly processes for cost effectiveness ) U: E5 E1 j: ]& E4 \+ T# x
: D4 q9 I6 M) p7 I0 S# W$ F( _职位要求:
- s0 `- M( q: Z' Z! r' t4 ?' |7 M: V(1) Bachelor, Master degree or PH.D. in Mechanical/ EE/ Automation/ Material Science, etc; (2) 10+Yr working experience of semiconductor WLCSP design/development or package R&D related field; (3) Experience with WLCSP NPI project as plus; (4) Good knowledge on mechanical design/simulation(Ansys or other software), material analysis, package assembly process, package qualification method, project management; (5) Ability to achieve results in a fast moving, dynamic environment. (6) Good team work, willing to learn, and logical thinking; (7) Good English communication (written and verbal) and interpersonal skills. |
|