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Title Responsibilities:( U* g* c; L) [$ s
+ F7 O2 W. \! V* {" w+ F# N" i3 Q& M1. Coordination among module engineering, SPICE, desgin service, reliability, marketing, , and fab on the delivery of tsmc technology.
" [5 \2 X! K' v+ O% }6 v2 R2. Responsible for technology development, characterization, qualifaication, transfer, and early customer engagement.
, b) L# g4 Q- }6 m" M3. Planning, setting priority, and execution of short and long term tasks. 3 V4 y4 |6 M: [$ I0 q4 r& m
; n9 |3 B2 q3 f! _" mRequirements:
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[' m! w' J6 ?- h8 D! u1. Minimum master degree in engineering field; L; {$ P7 n6 |& r0 [& y% N# U7 L
2. Minimum 8 years of experiences in process integration or device engineering.
# p2 s* x- h9 O* L$ ]3. Candidate with design or product experience is a plus z, z) o8 z2 [# } r
4. Fluent in English.: c# H4 S- g T( {, F7 j* V: Z
5. Work location in Hsinchu, Taiwan."
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8 t0 t. U' W5 \1 q# O2 w# Z$ @2 R! U3 d- [Package: around annual NT 300萬 ~700萬
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Stock:providing stock option depends on experience: N& v2 o1 m- B
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