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The following jobs prefer the candidates who own engineering master or PH.D. Education background plus ever worked for IDM companies( Intel, AMD, TI, Freescale, Broadcom, Qualcomm, NVIDIA….) or famous IC design houses.* k, x$ V( f+ e1 P3 A- n8 q! V
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(1) Semiconductor Engineer or Program Manager (US communication company) : annual NTD 220萬 (see attached Job Description)! {3 W- k @: T* k3 a( |: f
(2) OPC engineers (world Top 3 EDA company) : 2 people , annual salary is from NT 150萬 ~ 220萬 . E8 {1 e1 w; ?0 ?( w2 C
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Semiconductor Engineer5 \4 p( T# o2 I% u
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Job Description:
8 c$ p0 R& @# y1 z2 r6 rResponsible for technical support in Asia on tactical semiconductor fab process related issues for Memory and ASICs devices. Work as a technical liaison for the central component engineering team to be the first technical expert on site at semiconductor fab for line stop and line alert issues, to coordinate root cause analysis, and to drive for closure on corrective actions. Interface with semiconductor suppliers in Asia on new fab process qualification, new technology qualification, and fab transfer PCN assessment. Responsible for quarterly interfacing with key semiconductor suppliers in Asia on process improvement and on-going reliability assurance.
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3 S% o' Q# g4 W5 ZEducation:
$ l& T4 _, s/ DTypically requires BS/MS or equivalent in an engineering/ technical discipline (electrical, mechanical, etc.)8+ years related experience, G' k1 ^2 \$ i- M/ U
, E& z( e/ s- V2 [3 a; tSkill required:
: H4 j0 ?/ C) D7 q- L! sExtensive technical knowledge of Memory and ASIC fabrication process, qualification, reliability, characterization, testing, failure analysis tools/techniques and appropriate industry standards for Semiconductor technologies. Knowledge and experience on semiconductor device design and CAD layout is a plus. Experience on interfacing with semiconductor fab. Must also have in-depth working understanding of semiconductor fabrication process and critical process control methodology. Experience in supplier interface and driving suppliers on problem-solving activities. Excellent project management in a cross functional team based environment. Excellent written and verbal communication, team-building, negotiation and presentation skills.4 i. A- r! u8 {5 y# l' p
, x" d8 f* O1 }3 N; d) t意者請以 CV 與 chip123@chip123.com.tw 聯絡。來函絕對保密! |
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