FSA Announces Availability of Hard IP Quality Risk Assessment Tool V2.0

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不曉得台廠工程師們有沒有人採用 FSA 這項工具，哪沒有哪些經驗可以交流的？
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FSA Announces Availability of Hard IP Quality Risk Assessment Tool V2.0
May 2, 2007 -- The Fabless Semiconductor Association (FSA) has released its Hard Intellectual Property (IP) Quality Risk Assessment Tool version 2.0. The tool collects information about an IP vendor, its design methodology and the IP under evaluation to enable risk assessment across seven criteria: IP design, integration, verification, process technology, product documentation, reliability and test. Version 2.0 includes several new features that improve ease of use and enhance communication for both integrators and vendors. The tool has been built around a workflow process, allowing for flexibility and customization. It gathers information about an IP vendor’s design methodology, foundry qualification and details about specific IP. The questions are focused on IP families, making it less time-consuming for the vendor to complete and easier for the integrator to weight specific factors. This tool is the first deliverable in the FSA IPecosystem Tool Suite, a collection of tools that enable more efficient communication between IP vendors, integrators and foundries. Companies can use the IPe Tools as is or blend with their existing internal IP efforts. The Suite will enhance a company’s internal capability by providing value to the IP vendor through structured feedback from the integrator. It will also enable the creation of best practices to define a strong communication link between the IP vendor, integrator and foundry. Pricing and AvailabilityThe tool is available complimentary to the industry. To download version 2.0 and review the list of new features, visit the FSA IPecosystem website. Further enhancements to FSA’s Hard IP Quality Risk Assessment Tool are planned for release in Q3 2007. The second Tool in the Suite will focus on third-party IP licensing and will aid the negotiation process. It is also slated for release in Q3 2007. The follow-on Tools will address technology and manufacturability of IP. These efforts will begin this year with planned releases in 2008. ' q: \* q3 V# T# Y: U - X" k" F4 T2 n3 ~; `! h9 JGo to the Fabless Semiconductor Association (FSA) website for details. 6 m( z) ?3 Q7 T) t  t, s1 M * ]4 l* G" }$ E6 x" _2 m, x